EasyTube® 3000EXT
Advanced CVD System for University Labs and Industry R&D Facilities
The base system includes a cylindrical quartz process tube which can be from 70 mm to 130 mm ID depending on the desired substrate size. A range of optional modules can be configured to meet the specific requirements of the end user. Many of the options are available as upgrades after installation.
Substrate Sizes Up To 150 mm x 150 mm
Batch processing of multiple wafers per run is also possible
3-Zone Resistance Furnace
Temperatures up to 1200 °C or optional infrared/radio frequency induction heating
Preprogrammed Process Recipes
CVDWinPrC™ system control software
Optional Inert Glovebox
Unloading Sample Under Inert Ambient Conditions
STANDARD FEATURES:
Preprogrammed process recipes
Substrate sizes up to 150 mm x 150 mm (batch processing of multiple wafers per run also possible)
Cantilevered automatic substrate loading/unloading system
Up to 16 mass flow-controlled UHP gas lines
Atmospheric and/or low-pressure process configurations available
3-zone resistance furnace for temperatures up to 1200 °C or optional infrared/radio frequency induction heating
Proprietary real-time cascade process temperature control
High throughput with FastCool™ furnace
User ability to set warnings and alarms
Comprehensive software and hardware safety interlocks
CVDWinPrC™ system control software for real-time process control, data logging, and recipe editing
The EasyTube® 3000EXT model has an extended frame size to accommodate the larger system modules. These can include a glovebox, load-lock, a rolling furnace for rapid heating and cooling, an upstream RF plasma generator, and/or an option to increase the process chamber ID up to 200 mm to accommodate full 6” wafers.
The system is designed to meet today’s safety standards for handling pyrophoric, corrosive, flammable, and toxic gases such as hydrogen, silane, germane, diborane, hydrogen chloride, and metal-organic precursors. The system has application-configured safety protocols embedded into relay logic, PLC, and CVDWinPrC™ software.
EasyTube® 3000EXT Brochure
For a wide range of process configurations and high quality multi-layers
OPTIONS:
High-temperature resistance furnace up to > 1200 °C
Infrared heating for rapid thermal processing > 1100 °C
Radio frequency induction heating for process temperatures > 1500 °C
Upstream plasma
DC bias field assisted growth
Substrate rotation for improved process uniformity
Rectangular process tube for improved laminar gas flow
Liquid/solid source vapor delivery kit
Bubbler liquid auto refill
Glovebox with exhausted N2 or Ar purge
Run/vent: stabilizes gas flows (bypassing the process tube) before flowing into the process tube
Loadlock to isolate the process tube from the ambient atmosphere
High vacuum process chamber and/or load lock chamber
Residual gas analyzer
Air-to-water heat exchanger for cooling water
EasyGas™ hazardous gas cabinets
EasyPanel™ UHP gas panels for argon, nitrogen, helium, oxygen
EasyExhaust™ exhaust gas conditioning system (scrubber/pyrolyzer)
About Us
Over 40 years of expertise in CVD and thermal process equipment design and manufacturing.
“enabling tomorrow’s technologies ™ ”