MOCVD Systems

Metal Organic CVD (MOCVD) Systems

MOCVD is a process used for creating high-purity crystalline compound semiconducting thin films and micro/nanostructures. Precision fine-tuning, abrupt interfaces, epitaxial deposition, and a high level of dopant control can be readily achieved. It is widely adopted in R&D and industry for advanced optoelectronics, high-power, and high-speed electronics applications.

Devices that benefit from this technology include lasers and LEDs, solar cells, and field effect transistors (FETs). MOCVD technology allows for high volume production of bandgap engineered semiconducting heterostructures. MOCVD can also be used for the controlled production of 0D, 1D and 2D nanomaterials.

Wafer Rotation

Batch processing of single wafers or multiple wafers is available

Horizontal Induction (RF) Heating

Process Temperatures > 1500 °C


Load Lock Chamber

Prevents process chamber contamination from the air when loading/unloading substrates

CVDWinPrC™ Software

Real-time process control, data logging, and recipe editing

CVD Equipment’s Metal Organic Chemical Vapor Deposition System is automatically controlled via process recipes. The system consists of a Loadlock Chamber and UHV Process Tube. The Loadlock Chamber contains the transfer arm that moves the wafer between the loadlock and the Process Chamber. The high vacuum loadlock minimizes the transfer of ambient atmosphere into the process chamber. The system is designed for either ballroom or through-the-wall operation to minimize the footprint within your cleanroom. CVD will work with you to optimize the layout of the system within your facility. The overall system is designed for ease of maintenance

Our MOCVD systems have the capability of depositing layers of desired composition on a suitable substrate with graded composition (achieved by programming the software to ramp and switch in the appropriate flows). Exact process control produces MOCVD layers with abrupt interfaces or individual layers having a graded composition.


Horizontal or Vertical process chamber

Wafer size is configurable to meet the requirements of end-user

Resistance, IR, or RF heated depending on the temperature requirements

Temperature controlled showerhead

Wafer rotation

Molybdenum or SiC-coated graphite susceptor

Adjustable distance between wafer and showerhead

Low-pressure operation from 100 mTorr to 700 Torr

Automatic substrate loading/unloading

UHP gas lines

CVDWinPrC™ system control software for real-time process control, graphing, data logging, and process recipe editing

Bubbler circuits for use with solid or liquid bubblers, including pressure, temperature, and bubbling gas flow control

Comprehensive software and hardware safety system

Loadlock to protect the process chamber from the ambient atmosphere

Hydrogen purifier

Inert gas purged glove box

Residual gas analyzer

CiphercoN™ hazardous gas cabinets

MicroLine™ or SimplicitY UHP gas panels for argon, nitrogen, helium, oxygen

Exhaust gas conditioning system

Our MOCVD systems are designed to meet your production requirements with flexibility and low operating cost. The systems allow for the deposition of II-VI and III-V materials. Batch processing of single wafers or multiple wafers is available. The systems are designed to process wafer sizes as specified by the end user. A temperature-controlled showerhead delivering exact quantities of precursors and gases, coupled with substrate rotation during deposition, provides excellent deposition uniformity.

Operated through our CVDWinPrC™ process control software, the system automatically logs data and graphically displays the time-dependent values of user-selected parameters. CVDWinPrC™ allows users to load preprogrammed recipes, modify, check/create new recipes and view real-time or saved execution data.

Designed to meet today’s stringent safety standards, the system can safely handle pyrophoric and toxic chemicals. The load lock chamber option prevents process chamber contamination from the air when loading/unloading substrates. The system has application configurable safety protocols embedded into the CVDWinPrC™ software.

powered by CVDWinPrC

Powered by our CVDWinPrC™ process control software, the systems automatically log data and graphically show time-dependent values of user-selected parameters. CVDWinPrC™ also allows users to load preprogrammed recipes, modify, check, and create new recipes, and view real-time or saved process data.

Safety Protocols

The systems have application configured safety protocols embedded into relay logic, PLC, and CVDWinPrC™ software.


High-Touch Customer Service, Including:

  • Site Survey
  • Installation Coordination and Field Acceptance
  • NRTL/UL/CE Certification Available
  • Initial Start-Up Support
  • On-Site Training
  • Warranty Response and Remote Capability
  • Help Desk Support & Customized Service Contract Plans
  • Continuous Improvement Programs and Support
  • Customized Site Support Contracts
  • Spares and Consumables
  • Preventative Maintenance
  • Site Personnel Contracts
High Touch Customer Service
About Us

Over 40 years of expertise in CVD and thermal process equipment design and manufacturing.
enabling tomorrow’s technologies ™ ”