PowderCoat 1104™

In the powder coating process, precursor gases react to form a film deposited onto powder substrates. Thermodynamics and kinetics drive both precursor generation and decomposition. Source gases are supplied through a gas management system to the inlet of a heated Inconel chamber. A five-zone furnace with resistive heating is core to the system design, the chamber can maintain process temperatures up to 900°C. Ramp up and ramp down rates are achieved by real time PID precision control. Our robust process control system maintains temperatures within half a degree as well as the pressure within +/- 1% of set point throughout deposition runs. Rapid cooldown feature result in high throughput processing for high-volume manufacturing.

The multi-reactor design allows for parallel or sequential processing of up to four batches per system, where each zone can be independently controlled to set up the ideal thermal profile, from the inlet to the exhaust end of the reactor. The size of each process chamber is customizable to afford the flexibility to vary internal configurations for future differentiation.

CVD technology makes it possible to deposit continuous/conformal films on substrates with irregular surfaces, or on large quantities of closely packed substrates. A wide array of films may be deposited using CVD to further functionalize the surface with other materials for enhanced performance, including many technologically important semiconductors, nanomaterials, silicon, oxides, and metals. Dependent upon the process, particle size can vary from sub-micron to hundreds micron, and the coating thickness can be a few nanometers to tens of microns.

Hazardous gas storage and delivery, process reactor, and exhaust treatment subsystems can be provided as a complete integrated solution. Each component of the System is taken from our expansive library of process equipment configurations.