ET6000™
Next Generation Compact & Configurable Multi-Stack System for R&D and Pilot Production
The ET6000™ is ideal for a wide range of applications, each tube can be configured for thermal processes, including:
Multi-Configurable
Process Tubes
High Temperature Processing
Compact Footprint & Energy Efficient
APCVD & LPCVD
Precise Temperature
Control
50 Wafers per Tube; Supports 150 mm Substrates
CVD Equipment Corporation’s ET6000™ multi-tube horizontal system is industry proven with over twenty years in the field, delivering batch wafer processing for advanced research and development environments. Our system supports up to four independently controlled process tubes, enabling simultaneous processing of up to fifty wafers per tube.
ET6000™ delivers precise temperature control for a wide variety of thermal processes. Advanced cascade temperature control allows for accurate internal temperature profiling and responsive external control for consistent thermal performance within each zone.
The ET6000™ is flexibly designed with individually configurable process tubes to support both atmospheric and low-pressure operations for versatile applications. This system features configurable precursor gas management and effluent gas abatement options are also available.
The ET6000™ is equipped to handle pyrophoric, corrosive, flammable, and toxic gases. The system integrates robust safety features, including visual and audible alarms, automated emergency response protocols, and comprehensive safety interlocks. These features ensure safe and reliable operation in demanding research settings.
Atmospheric Processing up to 1200 °C
Annealing
Dopant Diffusion – POCl3/BBr3/BCl3
Pyrogenic/Wet/Dry Oxidation
High Temperature Processing up to 1400 °C
Annealing
Oxidation
Atmospheric or Low Pressure
LPCVD Processing up to 1100 °C
Polysilicon – Doped & Undoped
Silicon Nitride – Stochiometric and Low Stress
SiGe
TEOS/PSG/BPSG
LTO Silicon Dioxide – Doped & Undoped
STANDARD FEATURES:
3 zone resistive furnace with consistent thermal uniformity
Proprietary cascade control for precise process temperature
Up to four individually configurable process tubes
Atmospheric and low-pressure process configurations
Automatic cantilever substrate loading/unloading
Up to 50 wafer capacity per process tube
Differentially pumped double O-ring seals
Mass flow controlled ultra-high purity gas lines
Windows® based control software for real-time automatic process control and comprehensive documentation
Compact footprint with energy-efficient design
Remote monitoring capability
In-situ oxide cleaning
Optional exhaust gas conditioning system (not shown)
ET6000™ Brochure
For a wide range of process configurations and high quality multi-layers
powered by CVDWinPrC™
Powered by our CVDWinPrC™ process control software, the systems automatically log data and graphically show time-dependent values of user-selected parameters. CVDWinPrC™ also allows users to load preprogrammed recipes, modify, check, and create new recipes, and view real-time or saved process data.
Safety Protocols
The systems have application-configured safety protocols embedded into relay logic, PLC, and CVDWinPrC™ software.
High-Touch Customer Service, Including:
- Site Survey
- Installation Coordination and Field Acceptance
- NRTL/UL/CE Certification Available
- Initial Start-Up Support
- On-Site Training
- Warranty Response and Remote Capability
- Help Desk Support & Customized Service Contract Plans
- Continuous Improvement Programs and Support
- Customized Site Support Contracts
- Spares and Consumables
- Preventative Maintenance
- Site Personnel Contracts
About Us
Over 40 years of expertise in CVD and thermal process equipment design and manufacturing.
“enabling tomorrow’s technologies ™ ”